| Modules | Classes |
| 1. Wafer Cleaning, Oxidation | 2 |
|
2. Spinning Photoresist, Ashing |
2 |
| 3. Mask making, Photolithography, Etching | 3 |
| 4. Doping, Metallization, MOS capacitor | 3 |
| 5. Device Fabrication and Characterization such as MOS or bipolar transistor, Solar Cell, or LED | 4-5 |
Approach:
In the evolution of microelectronic processing, device densities have increased exponentially with associated decreases in characteristic dimensions, tolerances, and considerable increase in complexity. The tools that are presently used for such processes as photolithography, oxide deposition, and doping are high speed, robotic, and bear little similarity to their ancestors. At the same time, the basic steps involved in making integrated circuits are essentially the same. Students in this class will be exposed to these steps during their laboratory work. The technology and tools, while not state-of-the-art, have been chosen to allow students hands-on experience with device processing, something which is not possible with present day technology. Through the laboratory the students will experience the interrelationship between materials properties, electrical behavior, and processing conditions. As part of the course, how these same procedures are performed in a modern Fab will also be discussed. At the end of the course students will have a good understanding of the various process techniques involved in IC fabrication.
Microelectronics is also a truly interdisciplinary industry. Mechanical engineers work hand in hand with process engineers (often chemists and chemical engineers) to design processing tools. Electrical engineers developing circuit design code with input on new device technologies developed by physicists and new metallization schemes developed by materials scientists. Record keeping and communication of information with co-workers are essential to the field. In this course, students will work in interdisciplinary teams, and communication skills will be emphasized.
Organization:
Students will work on each of the modules in teams of four to five students. Reading materials from the text and from the lab procedures on the website will be assigned each week. Related reading quizzes/homework and/or short in-class quizzes or group presentations will be assigned in preparation for each week's activities. The Tuesday lectures will introduce and discuss lab procedures, as well as how similar procedures are done in state-of-the art facilities. At the end of each module student teams will prepare a final written report. The report will be no more than 10 pages in length and will discuss primarily the electrical and material characterization results and relate those to processing conditions during the fabrication sequence. Reports should be based on materials in the students' lab notebooks which all students must keep up to date each week.
Grading:
| 1. Bi-weekly homework and reading assignments -
Individual grade |
10% |
| 2. Lab attendance* - Individual grade | 5% |
| 3. Weekly oral presentation before the lab (group members will atlernate) - Team grade | 10% |
|
4.Written report on one or two of the first six modules (one group will compile data from all four groups) - Team grade |
15% |
| 5. Oral report and written presentation on device fabrication - Team grade | 30% |
| 6. Midterm - Individual grade | 10% |
|
7. Final - Individual grade |
30% |
*Attendance Policy: With the team nature of this course, and reconfiguration required between tasks, it is difficult to make up absences. For this reason, no unexcused absences will be allowed. If you find you must be gone on a lab day, obtain permission from the instructor at least a week in advance so a makeup can be scheduled. If you miss a lab without obtaining advance permission, then you must provide a campus approved reason (doctors statement etc.) for missing the class.