CHEN/PHGN  435/535 - Interdisciplinary Silicon Processing Lab
Spring 2001

Prelab IC: Photoresist Application

Name: __________________________

Read photolithography lab procedures and Campbell p. 182 -194

  1. Why is it important to clean and dry wafers before applying photoresist?

    2.  

     

  2. What is accomplished during the soft bake step?

    3.  

     

  3. Photoresist contains 3 components. Name them and describe their function

    4. i.)

    ii.)

    iii.)

     

  4. What is the main component in positive resist developer?

    5.  

  5. Would the following changes require you to increase or decrease the devlopment time?

    6. i) Increase the spin rate?

    ii) Decrease the exposure time?

    iii) Increase the softbake temperature.?