Class 1,000 Cleanrooms
Hill Hall 312 & CoorsTek 040
Alex Dixon – firstname.lastname@example.org
The facility houses two Class 1,000 Cleanrooms with photolithography capabilities for substrates up to 3 inch (76 mm) diameter and features down to 2 μm resolution.
The March CS 1701 Reactive Ion Etcher delivers performance often associated with high-investment etching tools. The system is excellent for metal etching, silicide etching, and etching of III-V compounds, anisotropic etching of nitrides, oxides and polyimides.
Key performance features of the CS 1701 system include the large DC bias and the ability to control process pressure independent of gas flow. The system allows users a wide variety of etch profiles ranging from anisotropic requiring high aspect ratios to sloped walls. The system has 3 process gases (O2, Ar, SF6) and a N2 purge.
The Plasma-Preen System is a plasma cleaning/etching system with O2 and Ar capabilities which uses microwaves to excite the plasma.
SPIN COATER/HOT PLATE
Spin coating is a procedure used to deposit solution processed materials into uniform thin films onto flat substrates. Film thickness can be controlled by varying spin speed from 100 – 10,000 RPM.