Cleanroom and Lab Access CoursesThis training is setup to prepare you with safety information and emergency procedures in order to access Coorstek 040, 040B, and the 040 cleanroom as well as the Hill Hall cleanroom. Prior to your first visit, please download MSDS for...
Nanyte Beam UV - Laser Lithography Location CoorsTek 040 Contact Alex Dixon - agdixon@mines.edu Instrument Details The Nantye beam is a desktop, maskless lithography tool enabling at will nanopatterning without the use of a photomask. The tool can write patterns with...
Raith Voyager E-beam Lithography System Available April 2024Location CoorsTek 001-M Contact Alex Dixon - agdixon@mines.edu Instrument Details The Raith Voyager E-beam lithography system is a fully automated nanolithography system, capable of writing sub 10 nm lines in...
Class 1000 (ISO 6) CleanroomsLocation Hill Hall 312 & CoorsTek 040Contact Alex Dixon - agdixon@mines.eduFacility Details The facility houses two Class 1000 (ISO 6) Cleanrooms with photolithography capabilities for substrates up to 3 inch (76 mm) diameter and...
ABM UV Mask AlignerLocation CoorsTek 040-CContact Alex Dixon - agdixon@mines.eduInstrument Details The ABM mask aligner features an intensity-controlled 6"x6" illumination area, strong illumination at both 400 and 350, two simultaneous operating alignment cameras,...
Karl Suss Mask AlignerLocation Hill Hall 312Contact Alex Dixon - agdixon@mines.eduINSTRUMENT DETAILS Karl Suss MJB3 UV400 Mask Aligner is an instrument enabling photolithography, which is a microfabrication process used to selectively remove parts of a thin film to...
AutoGlow 200 Reactive Ion EtcherLocation Hill Hall 310Contact Alex Dixon - agdixon@mines.eduINSTRUMENT DETAILS The AutoGlow 200 reactive ion etcher is a table-top plasma system that can be used for plasma cleaning or RIE processing with O2 and SF6 plasmas. It can...
FurnacesLocation Hill Hall 310Contact Alex Dixon - agdixon@mines.eduFacility DetailsDIFFUSION FURNACETube furnace used in the manufacturing of semiconductor components. Used to add doping impurities into high purity silicon wafers, thereby creating embedded...
Wire BonderLocation Hill Hall 312Contact Alex Dixon - agdixon@mines.eduINSTRUMENT DETAILS The TPT hb05 is a benchtop manual wire bonding system with gold, silver, aluminum or copper wire and a 6:1 mouse ratio. Ideal for attaching gold contact wires to microscopic...